Electromagnetic Interference and Signal Integrity Principles

See also: Power Sys. Design SI Fundamentals High Perf. Design ->EMI and SI SI Principles SI for Digital Designs

A Two Day Seminar Course Description: This seminar will provide the participants with a background into EMI principles and international measurement standards and authorities. Following the introductory EMI topics, the seminar will consider signal integrity and design principles for low EMI emissions. Topics in this section include power supply EMI, parasitic coupling, "ground bounce" delta-I noise, bus terminations and bonding and shielding for I/O cabling. Course Objective: At the end of this seminar, participants will understand the principles of EMI, bonding and shielding, and the international emissions standards. Lastly, participants will have been exposed to the relationship of specific digital electronic design parameters to EMI performance. Who Should Attend: Logic and signal integrity engineers designing digital computer, telecommunications and industrial systems. EMI engineers responsible for compliance of digital computer, telecommunications and industrial systems. Course Curriculum: Day 1 - Part 1: EMI Principles and Measurements: Electromagnetic Interference (EMI) Signal Theory Spectral Decomposition of Digital Signals - Fourier Analysis Antenna sources and radiation field properties of EMI Dipoles - Common Mode (CM) EMI sources Magnetic Loops - Differential Mode (DM) EMI sources Practical sources of EMI Radiation Parasitic and unbalanced coupling as sources of EMI radiation Grounding and (delta-I) noise in electronic devices Poor I/O cable bonding and shielding Power System Considerations of EMI Switching power system fundamentals for EMI Common mode EMI coupling in power supply packaging Common mode and differential mode EMI in DC power distribution Common mode and differential mode coupling in power cords System considerations of Conducted and Radiated EMI System grounding - single point vs. multi-point grounding EMI sources between power system and backplane Multi-cabinet signal cabling, and grounding Logic return ground vs. chassis ground Day 1 - Part 2: EMI Measurement Techniques and International Compliance Standards: Open Field Site Test Requirements The open field E-Field measurement site requirements The open field Magnetic field measurement site requirements Federal Communications Commission (FCC) emission limits Class A industrial, 10 and 30 meter limits Class B home and retail 3 and 10 meter limits FCC required measurement techniques Verein Deutsche Electronishe (VDE) emission limits Class A industrial Class B home and retail VDE required measurement techniques C.I.S.P.R. Radiated and Conducted EMI Limits - CE Mark Requirements Class A industrial Class B home and retail C.I.S.P.R. required measurement techniques CE Mark Requirements Day 2 - Part 1: EMI Measurement Techniques and International Compliance Standards: System lateral size and the effects on measurements 3 meter vs 10 vs 30 meters Far field estimates and beamwidth EMI wavelength effects as function of system size and cable length Compliance measurement effects of system size Day 2 - Part 2: Putting Good Signal Integrity Together with Good EMI Design: Power supply packaging and power distribution for low EMI emissions Relationship of crosstalk and coupling to EMI emissions Reduction of parasitic and unbalanced coupling to reduce EMI radiation Delta-I EMI noise reduction by proper grounding in electronic device, connector and cable packaging. Bus terminations and backplane grounding for low EMI designs I/O cable bonding and shielding for EMI radiation reduction Day 2 - Part 2 - Discussions of Client Designs

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