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"Specification and Characterization of a Multi-GigaHertz Differential Backplane Connector"

See also:
Surface Mount Backplane Connector...
Semiconductor Package Power...
Case Study of Cisco Package Redesign...
Case Study of Package Power...
DDR-II SDRAM Technology...
Infiniband Cable Equalizer...
Motorola WarpLink Reference Design...
OC-48/2.5 Gbps Design Rules...
The limits of FR-4...
SI & Validation of BLVDS...
Gigabit Interconnects...
Design of Gigabit Copper Fibre Channel...
GTL+ Backplane Termination...
->GHz Differential Connector ...
Timing of SDRAM Design...
Transmission Line Skin Effects...
MCM Compute Node Thermal Failure...
QuickRing Backplane System
Bussed Clock Architectures for ATM...
Simplifying FutureBus Backplane...
Infiniband and the limits...
SI Solutions for GTLP...
A Baker's Dozen...

 

Presented at the Design Supercon97

Dr. Edward P. Sayre, P.E.
Mr. Michael A. Baxter, B.S.E.E.
Jacques Longueville - Siemens Electromechanical Components (Now Tyco)

Abstract

North East Systems Associates Inc. (NESA) of Stow, MA U.S.A. has recently completed the AC electrical characterization of a new, high performance differential connector developed by Siemens, N. V. This new connector, SpeedPacTM, has performance far beyond that reported in the literature for differential backplane connectors. SpeedPacTM was tested for transmission performance, differential impedance and crosstalk characteristics over a variety of risetime and data rate conditions with very positive results. This connector has been shown to meet or exceed stringent data rate requirements and specifications set forth by potential end users. It is geared toward high-end current and future systems under design in the computer and communications market segments.

SpeedPacTM is a registered trademark of Siemens Inc.

->This paper is available from NESA for $15.00 to cover management costs. We accept credit card payment for purchase of the papers. The requested paper will be emailed to you shortly after your order is received.

 

 

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