"A Signal Integrity Revolution in Surface Mount Backplane Connectors and SPICE/S-Parameter Extraction Methodology"

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Presented at DesignCon Santa Clara, CA - February 2004 Dr. Edward P. Sayre, P.E. Dr. Edward P. Sayre, III Mr. Michael Baxter Mr. Scott Mickievicz, ITT Cannon Industries Abstract Tempus-6000 is a Surface Mount Technology (SMT) connector with significant differences in improved signal integrity and mechanical performance over connectors that require through vias for mounting and connections. Like its predecessor, the thru-pin Tempus-4000, the T-6000 is a differential mode only connector and is available in both 5-row and 8-row versions with improved daughter card C & F row grounding and impedance control. Thinner pins result in Smaller parasitics for the headerside pins and the continuation of the dedicated grounded C & F row pins have larger aspect ratios (flat and wider) than standard pins for improved return impedance and lower inductance. The shield and ground return pins use a direct ground connect buried via technology in which the patented connector pin stubs are soldered directly into the buried vias for improved mounting strength and low parasitics. NESA has utilized a unique SPICE extraction process to characterize the T-6000 connector as well as its close relative, the thru-pin Tempus-4000. This process emphasizes both time and frequency domain electromagnetic analyses as the first step in a more complete SPICE extraction of the internals of the T-4000 and T-6000 shielded connectors and mounting footprint parasitics. The process is unique in that those portions of the connector appropriately described as a “distributed system” will be represented in terms of a frequency dependent Transmission matrix (T—Parameters) while those portions appropriately described as “parasitics” will be described in terms of unique coupled circuit elements or equivalent T-Parameters, resulting in a comprehensive description of the differential connector paths with mounting or footprint parasitics. A set of test boards were designed which specifically address the issues of footprint extraction, use of calibration lines for transmission and impedance de-imbedding and the “trimming” of the electromagnetic extracted parameters to fit the experimental data. The work makes use of NESA’s “Passive Signal Integrity™” virtual signal integrity laboratory including its recent extensions to include both the time and the frequency domains. This paper describes how this methodology was followed and the results of the extraction analysis of the unique T-6000 and T-4000 connectors. The process provides the connector designer as well as its adopters with the means to independently vary the footprint parasitics depending on the mounting footprint trace approach (broadside or edge coupled), trace routing density and PCB material selection. Results show that the elimination of the thru-via stubs in both the signal traces and ground return structure by the use of SMT mounting improves the overall bandwidth of Tempus-6000 enabled backplane differential channels and provides a clear approach to 10 Gbps operation across backplanes. ->This paper is available from NESA for $15.00 to cover management costs. We accept credit card payment for purchase of the papers. The requested paper will be emailed to you shortly after your order is received.

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